5 min. gel general purpose adhesive. A two component, five minute epoxy system with optical clarity and high strength for quick repair applications. CLR 1220 / CLH 6858
Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930
General Purpose Epoxy. An unfilled, room temperature cure, clear laminating system. Its low viscosity gives the system excellent wet -out properties to fibreglass and other reinforcing fibres. The material will also saturate wood readily. For a faster system use hardener CLH 6333. CLR 1625 / CLH 6330
General Purpose Epoxy. An unfilled, room temperature cure, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material will also saturate wood readily. CLR 1625 / CLH 6333
Abrasion Resistant Epoxy. An abrasion resistant, two component epoxy surface coat. CLR 1710 / CLH 6710
Heat and chemical/fuel resistant adhesive/laminating. A two component heat and chemical resistant epoxy laminating system. CLR 1730 / CLH 6372
General Adhesive room temperature cure. Resistant to Toluene, Ethanol, Aviation Gas and Diesel Fuel. A low viscosity, two component, chemical resistant epoxy system. Post cured material has excellent resistance to most petroleum based fuels and solvents during exposure at ambient and elevated temperatures. CLR 3080 / CLH 6372
High Temperature. A single component, 100% solids, low viscosity, impregnating compound for coils and transformers. This product is also suitable for sand casting. CLS 9600
A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611
Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616
1:1 machine dispense adhesive. Adhesive for bonding synthetic aggregates to metal. A medium viscosity, room temperature curing, two component epoxy adhesive. Product was developed with improved thin film set time when bonding metal substrates. XR 52092 / XH 62093
High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures. XRD 1014 / XHD 1015
1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing. XRD 1018 / XHD 1019